Product Features

A minute application model for Φ0.2-mm point application and 0.2mm width line application

High accuracy even with minute amounts

Application is highly accurate and stable even with minute μL-level amounts.

Lightweight, compact design

By reducing the casing volume as much as possible, we cut down on the volume of waste fluid. It can be installed with ease on miniaturized tabletop robots.

Stable application over an extended period of time

With a structure not easily affected by changes in viscosity brought on by fluid temperature, lots or the like, it stabilizes the application amount and contributes to a decrease in the number of adjustments and the amount of down time.

US PAT. 8556608
US PAT. 10364813
US PAT. 10233921

Primary Applications
Point application of minute quantities of soldering paste to a PCB
Application of waterproofing sealant to the outer edge of a camera lens
Soldering paste
Silver paste
Nickel paste
Copper paste
Silicone adhesive
Epoxy adhesive
UV-curing adhesive
Insulating adhesive
Conductive adhesive
Die bonding paste
Underfill agents
Thermal grease
Silicone grease
Industrial grease
Lubricating oil
Organic solvents
Coating agents
Desiccating agents and various slurries

Application Flow

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